Articles and presentations



    Published articles:
    • Vapour Phase Soldering Applications for PCB Assembling
    • Paul Svasta and Ioan Plotog, Politehnica University of Bucharest, Center for Technological Electronics and Interconnection Techniques, UPB-CETTI
    • Published in Producktion von Leiterplatten Und Systemen, ISSN 1436-7505, pg.1861-1870, August 2010. A copy of the article can be found here.
    • Abstract: The advancements in electronic packaging (continuously increasing I/O density of electronic components dramatically decreasing soldering area, increasing number of different PCB substrate technologies and PCB finishes) and additional difficulty of the avoidance of lead in solders as imposed by the RoHS Directive let the soldering process become a major reliability issue. The paper presents some results of an investigation which compares the solder joint quality of especially designed test boards after VPS (vapor phase soldering) and soldering in a conventional infrared convection oven. Three different types of test boards (aluminium substrate, glass substrate and FR4) with five different finishes and populated with resistors in daisy chains were investigated. A discussion on the correlation of electrical, thermal and mechanical solder joint quality test results is enclosed.

    • Promoting the Entrepreneurial Spirit within the Romanian Electronics Industry
    • Rosemari Fuica1, Paul Schiopu2 and Ioan Plotog2
      1Association for Promoting Electronic Technology APTE, Bucharest, Romania
      2Politehnica University of Bucharest, Center for Technological Electronics and Interconnection Techniques, UPB-CETTI, Romania
    • Published in 15th International Symposium for Design and Technology of Electronics Packages, ISBN 978-I-4244-50330309, pg.409-412, September 2009. A copy of the article can be found here.
    • Abstract: The objective of this paper is to present the strategic project "Promoting the entrepreneurial spirit within the Romanian electronics industry", co-financed by European Social Fund (ESF). Its main objective is to promote entrepreneurship in Romanian electronics industry, the electronics packaging education and technological transfer, to offer technological and technical support for innovative SMEs, in order to compensate the small entrepreneurs number (~50% of the European average)

    Given presentations:
    References:
    • Rosemari Fuica and Alexandru Borcea, Book title: "Entrepreneurship - Gender - Geographies and Social Context", Chapter title: "Does Romania have a chance to join the innovation driven economy?" InTech - Open Access Publisher, 10. 03. 2012, ISBN 979-953-307-531-9