Go to the on-line course or download from "Content" the PDF files of the chapters
name Electronic packaging and assembling technologies of microsystems
objectives see in syllabus (Knowledge, Skills, Competences)
target students bachelor, master, Ph.D. students
by POLITEHNICA University of Bucharest, Center for Technological Electronics and Interconnection Techniques (UPB-CETTI)
"Electronic packaging and assembling technologies of microsystems"
oriented course for understanding the electronic packaging and the related
assembling technologies of microsystems and electronic modules.
Number of credits
POLITEHNICA University of Bucharest
Prof. Norocel Codreanu
Prof. Norocel Codreanu
Prof. Ciprian Ionescu
Assoc. Prof. Ioan Plotog
Lect. Mihaela Pantazica
of electronics, passive and active electronic components and circuits, materials
for electronics, microelectronics and modern technologies used in electronics
Knowledge: Advanced knowledge
in the field of electronic packaging and assembling technologies of modules and
microsystems, involving solid understanding of manufacturing theories based on
world recognized standards.
Skills: Ability in selecting
the proper the packaging technology, based on specific requirements, in the
manufacturing of electronic modules and advanced ability of selecting the
suitable assembling technology for realizing specific microsystems.
of advanced ability to use engineering knowledge, skills, innovation, autonomy
and methodological abilities in electronic packaging and assembling
technologies of microsystems, including research and development in this field;
ability to manage and perform engineering packaging tasks.
introduces students to modern electronic packaging and assembling technologies
of microsystems and modules. It exposes students the fundamentals of
microsystems packaging and assembling technologies, packaging materials,
current assembling technologies, basics of nanopackaging and packaging
technologies trends. Labs are integral parts of the course, and expose students
to various practical manufacturing and assembling issues/problems found in
industry. This course provides students with the opportunity to develop and
demonstrate an understanding of manufacturing processes, techniques and
technologies which are used to optimise the development of microsystems/modules.
It will also enable students to experience the full cycle of manufacturing and
testing of electronic products. Additionally, each student will manufacture a
small complexity electronic module, receiving permanently real feedback from various
Content(click on the chapter title to acces the .PDF file)
1) Fundamentals of
microsystems packaging and assembling technologies
Packages and technologies
2) Packaging materials
for packaging technology
materials and processes
materials used in the manufacture of printed circuit boards
for lead-free products
3) Assembling technologies
4) Basics of nanopackaging
Applications of nanomaterials
5) Packaging technologies trends
theoretical part of the course is presented with PowerPoint slides, technological
examples, case studies and problem-based learning. Based on the MECA Knowledge
Alliance project, a Moodle learning environment in the form of HTML tutorials
is also considered, in partnership with Giga Electronic International, Romania.
The laboratory is based on interactive activities using the Lite version of the
Cadence/OrCAD 16.6-2015 design environment, other various CAD-CAM tools and the
technological facility of UPB-CETTI for microsystems/modules manufacturing.
Additionally, during the lab, students are involved in practical technological tasks,
addressing various electronic packaging issues and related assembling
technologies for the development of microsystems and electronic modules.
evaluation is based on the examination of concepts acquired in the course and consists
of the following components:
40% - Final
report targeting various problems and issues, according to those solved during
the lectures and the labs;
Knowledge test with a multiple choice questionnaire and oral discussion.
R. - Fundamentals of Microsystems Packaging, McGraw-Hill, 2001, ISBN:
S. and Schmid, S. R. - Manufacturing Engineering and Technology, 4th ed.,
Prendice-Hall, N.J., 2001;
J. R. - Product Design and Manufacture,
Prendice-Hall, N.J., 1995;
C. A., Electronic packaging and interconnection handbook, McGraw-Hill,
C. F., Jr., Printed circuits handbook, 6th ed.,
McGraw Hill Professional, 2007, ISBN 978-0071510790;
Lau, C. P. Wong, J. L. Prince, W. Nakayama, Electronic Packaging – Design,
Materials, Process and Reliability, McGraw-Hill, 1998;
Y., Wang Z., Chen J., Introduction to Microsystem Packaging Technology,
CRC Press, Boca Raton, 2011, ISBN 978-143981910-4.