Primary Objective of the HISOLD-RO 2009 workshop is to provide an international forum for dissemination of information and scientific results relating to COST MP0602 project, WG2/MP0602 meeting and GP-WG2 project, HISOLD 4P-Q&R, KOM meeting. The presentations of all workshop participants will be published in the Proceedings.

Workshop Committee

   COST MP0602 Action chair:

• Ales KROUPA, Institute of Physics of Materials, Brno, Czech Republic
• Andrew WATSON, The University of Leeds, Institute for Materials Research, Leeds, England

   WG-2 Session chair:

• Jürgen VILLAIN, Center of Competence of Mechatronics, Materials and Manufacturing in Mechatronics, University of Applied Sciences Augsburg, Germany

    Workshop HISOLD-RO chair:

• Paul SVASTA, "Politehnica" University of Bucharest, Romania
• Ioan P. MIHU, University "Lucian Blaga" of Sibiu, Romania

    Workshop Program Chair:

• Ioan PLOTOG, University of Bucharest, Romania

Major topics are:

• advanced materials for high temperature;
• solder joints properties;
• solde joints quality, functionality and reliability as function of Pad-Pin-Paste-Process
• electronic components and packaging (SMD, μBGA, CSP, FC);
• electronic and optoelectronic modules manufacturing technologies(SMT/PCB/ MCM);
• printing wiring board - materials, processing, process simulation and applications;
• reliability of new packaging concepts interconnection technology;
• thermal management, reliability and life time prediction;
• quality management: Q- assurance, Q- control, Q- inspection;
• design for environment and environmentally conscious manufacturing; clean technologies;
• concurrent engineering and project management on electronic packages;
• networking and Internet education.

Location

The conference will be held in the "Silva" hotel, Sibiu, Romania.
E-mail: hisold.ro@cetti.ro,
Web page: www.cetti.ro/hisold-ro
Tel: +40 21 3169633; +40 21 4024650
Fax: +40 21 3169633

Organized by:

• UPB-CETTI (Center for Technological Electronics and Interconnection Techniques), "Politehnica" University of Bucharest, Bucharest Romania, Faculty of Electronics, Telecommunications and Information Technology

Deadlines:

The last day for registration is June 29, 2009 and for abstract delivery is: August 27, 2009
The abstract shall be half page of text (200 - 250 words), using no smaller than 11-point type font.
Please use e-mail to hisold.ro@cetti.ro for any correspondence, registration, submission of abstract and paper.