The project

The last day for registration is June 29, 2009 and for abstract delivery is: August 27, 2009

 
Primary Objective of the HISOLD-RO 2009 workshop is to provide an international forum for dissemination of information and scientific results relating to COST MP0602 project, WG2/MP0602 meeting and GP-WG2 project, HISOLD 4P-Q&R, KOM meeting. The presentations of all workshop participants will be published in the Proceedings.

Workshop Committee

   COST MP0602 Action chair:
  • Ales KROUPA, Institute of Physics of Materials, Brno, Czech Republic
  • Andrew WATSON, The University of Leeds, Institute for Materials Research, Leeds, England
   WG-2 Session chair:
  • Jürgen VILLAIN, Center of Competence of Mechatronics, Materials and Manufacturing in Mechatronics, University of Applied Sciences Augsburg, Germany
    Workshop HISOLD-RO chair:
  • Paul SVASTA, "Politehnica" University of Bucharest, Romania
  • Ioan P. MIHU, University "Lucian Blaga" of Sibiu, Romania
    Workshop Program Chair:
  • Ioan PLOTOG, University of Bucharest, Romania

Major topics are:
  • advanced materials for high temperature;
  • solder joints properties;
  • solde joints quality, functionality and reliability as function of Pad-Pin-Paste-Process
  • electronic components and packaging (SMD, μBGA, CSP, FC);
  • electronic and optoelectronic modules manufacturing technologies(SMT/PCB/ MCM);
  • printing wiring board - materials, processing, process simulation and applications;
  • reliability of new packaging concepts interconnection technology;
  • thermal management, reliability and life time prediction;
  • quality management: Q- assurance, Q- control, Q- inspection;
  • design for environment and environmentally conscious manufacturing; clean technologies;
  • concurrent engineering and project management on electronic packages;
  • networking and Internet education.


Location

The conference will be held in the "Silva" hotel, Sibiu, Romania.
E-mail: hisold.ro@cetti.ro,
Web page: www.cetti.ro/hisold-ro
Tel: +40 21 3169633; +40 21 4024650
Fax: +40 21 3169633

Organized by:
  • UPB-CETTI (Center for Technological Electronics and Interconnection Techniques), "Politehnica" University of Bucharest, Bucharest Romania, Faculty of Electronics, Telecommunications and Information Technology

Deadlines:

The last day for registration is June 29, 2009 and for abstract delivery is: August 27, 2009
The abstract shall be half page of text (200 - 250 words), using no smaller than 11-point type font.
Please use e-mail to hisold.ro@cetti.ro for any correspondence, registration, submission of abstract and paper.