The project

The last day for registration is June 29, 2009 and for abstract delivery is: August 27, 2009

Primary Objective of the HISOLD-RO 2009 workshop is to provide an international forum for dissemination of information and scientific results relating to COST MP0602 project, WG2/MP0602 meeting and GP-WG2 project, HISOLD 4P-Q&R, KOM meeting. The presentations of all workshop participants will be published in the Proceedings.

Workshop Committee

   COST MP0602 Action chair:
  • Ales KROUPA, Institute of Physics of Materials, Brno, Czech Republic
  • Andrew WATSON, The University of Leeds, Institute for Materials Research, Leeds, England
   WG-2 Session chair:
  • Jürgen VILLAIN, Center of Competence of Mechatronics, Materials and Manufacturing in Mechatronics, University of Applied Sciences Augsburg, Germany
    Workshop HISOLD-RO chair:
  • Paul SVASTA, "Politehnica" University of Bucharest, Romania
  • Ioan P. MIHU, University "Lucian Blaga" of Sibiu, Romania
    Workshop Program Chair:
  • Ioan PLOTOG, University of Bucharest, Romania

Major topics are:
  • advanced materials for high temperature;
  • solder joints properties;
  • solde joints quality, functionality and reliability as function of Pad-Pin-Paste-Process
  • electronic components and packaging (SMD, μBGA, CSP, FC);
  • electronic and optoelectronic modules manufacturing technologies(SMT/PCB/ MCM);
  • printing wiring board - materials, processing, process simulation and applications;
  • reliability of new packaging concepts interconnection technology;
  • thermal management, reliability and life time prediction;
  • quality management: Q- assurance, Q- control, Q- inspection;
  • design for environment and environmentally conscious manufacturing; clean technologies;
  • concurrent engineering and project management on electronic packages;
  • networking and Internet education.


The conference will be held in the "Silva" hotel, Sibiu, Romania.
Web page:
Tel: +40 21 3169633; +40 21 4024650
Fax: +40 21 3169633

Organized by:
  • UPB-CETTI (Center for Technological Electronics and Interconnection Techniques), "Politehnica" University of Bucharest, Bucharest Romania, Faculty of Electronics, Telecommunications and Information Technology


The last day for registration is June 29, 2009 and for abstract delivery is: August 27, 2009
The abstract shall be half page of text (200 - 250 words), using no smaller than 11-point type font.
Please use e-mail to for any correspondence, registration, submission of abstract and paper.