UPB-CETTI

Electrical and Computer Engineering

Politehnica University of Bucharest

 

Cadence Registered Mark

Cadence Academic Network Lead Institution for PCB design methodology

 

 


Courses

Passive Components and Circuits

Interconnections Techniques in Electronics

CAD Techniques

Electronics

Electrical CAD


Articles

New Methods of Testing PCB Traces Capacity and Fusing authors Norocel Codreanu, Radu Bunea, and Paul Svasta

TIE 2010 Event - student's contest article by Andreea Bonea, Press Officer of IEEE CPMT Student Branch Chapter of the Politehnica University of Bucharest, Romania

Interconnection Techniques in Electronics (TIE) Event – International Student Professional Contest 20th Edition article by Cristina Marghescu, IEEE CPMT Student Branch Chapter of the Politehnica University of Bucharest, Romania

The first edition of the third decade of the TIE event article by Norocel Codreanu, Andreea Bonea

Interconnection Techniques in Electronics (TIE) International Professional Student Contest in the field of advanced PCB design article on LinkedIn by Norocel Codreanu, Andreea Bonea


Professors and Trainers

Svasta Paul | paul.svasta@cetti.ro

Codreanu Norocel | norocel.codreanu@cetti.ro

Ionescu Ciprian | ciprian.ionescu@cetti.ro

Victor Vulpe | victor.vulpe@cetti.ro

Davidescu Mircea | mircea.davidescu@cetti.ro

Vasile Alexandru | alexandru.vasile@cetti.ro

Drumea Andrei | andrei.drumea@cetti.ro

Ioan Plotog | ioan.plotog@cetti.ro


The professional student contest "Interconnections Techniques in Electronics - TIE" TIE

www.tie.ro

The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from many University Centers since 1992. Students have a greatopportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging.

   TIE 2009 was held in April 2009 and the local phases took place in every University Center in March 2009. In the finals, competitors were the students with the best results in the qualification phases. TIE 2009 was organized this year between 9 and 12 April 2009 , in Galati.

 



 

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